XEM7350 Integration Evaluation Acceleration

xem7350-720x648
XEM7350-K70T
XC7K70T-1C, 512-MiB DDR3
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XEM7350-K160T
XC7K160T-1C, 512-MiB DDR3
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XEM7350-K410T
XC7K410T-1C, 512-MiB DDR3
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XEM7350-K410T-3E
XC7K410T-3E, 512-MiB DDR3
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FANSINK-30X30
Fan heatsink for the XEM7350
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The XEM7350 is a USB 3.0 integration module based on the Xilinx Kintex-7 FPGA. In addition to a high gate-count FPGA, the XEM7350 utilizes the high transfer rate of USB 3.0 for configuration downloads, enabling speedy FPGA configuration and data transfer. With integrated SDRAM, power supplies, platform flash, high-speed transceivers, FMC-HPC connector, and voltage/current/temperature monitoring, the XEM7350 is ideal for high-performance I/O integration.

Feature Image FrontPanel SDK

Opal Kelly's FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.

Feature Image Prototyping and OEM Integration

Opal Kelly FPGA integration modules are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there's simply no faster, more reliable, production-ready way to jump start your FPGA design.

Block Diagram

xem7350
gigabit-v3
GIGABIT SERIAL TRANSCEIVERS (x8)

Eight high-speed gigabit transceivers are available with standard support for PCI Express, DisplayPort, HD-SDI, XAUI, Aurora, SATA, and others operating up to 6.6 Gb/s (12.5 Gb/s optional).

usb
SUPERSPEED USB 3.0

Measured performance at over 340 MiB/s for real-world data transfers to/from the PC.

ddr-memory
512 MiB DDR3

Integrated 512-MiByte DDR3 provides plenty of on-board memory for high-performance applications, including image capture and data acquisition.

device-sensors
DEVICE SENSORS

Integrated device sensors provide real-time measurement of temperature as well as voltage and current of the on-board high-efficiency switching power supplies. Measurements are available via the API.

Customer Deployments

  • Bioinformatics co-processors
  • Radar system - test interface, system integration, field testing
  • Camera interface for IR and LIDAR 3D cameras
  • Equipment for analyzing satellite imagery
  • University research
  • Design of equipment for mineral exploration

Applications

  • Image or video capture / processing
  • Data acquisition (including JESD204B)
  • ASIC / hardware-based simulation and verification
  • High-Speed (Gigabit) Serial Interfaces
  • Digital communications
  • High-speed USB / FPGA co-processor
  • Evaluation platform for your product
  • Custom test equipment
  • Cryptography
  • Data Security

Technical Specifications and Support

Features & Specifications

  • Xilinx Kintex-7 XC7K70T-1FBG676C (option: XC7K160T-1FFG676C, XC7K410T-1FFG676C)
  • 2x 16-MiB serial flash (Numonyx N25Q128A)
  • 512-MiB DDR3 (Micron MT41K256M16HA)
  • Small form-factor -- 80mm x 70mm x 15.1mm (3.15" x 2.76" x 0.60")
  • High-speed USB 3.0 interface (Cypress FX3) for configuration and data transfer
  • Measured performance over 340 MiB/s
  • Self-powered by external DC source
  • Low-jitter 200 MHz clock oscillator
  • Low-jitter 100 MHz clock oscillator (Gigabit Transceiver Reference)
  • Four LEDs
  • One FMC-HPC board-to-board connector
  • 76 user I/O including GCLK pins on FMC expansion (-70T)
  • 170 user I/O including GCLK pins on FMC expansion (-160T and -410T)
  • 8 Gigabit Transceivers and 3 reference clock pairs
  • Independent access to VCCO bank voltages
  • On-board device sensors for real-time voltage, current, and temperature monitoring
  • JTAG pins available on the expansion connectors
  • Full FrontPanel virtual control panel support
  • Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java