Add-On Boards
Reference designs, breakout boards, and other peripherals are available for many of our FPGA modules.
Add-On Boards
Reference designs, breakout boards, and other peripherals are available for many of our FPGA modules.
Product Release
2024-01-07
Lifecycle Status
Production
Minimum Order Quantity
1 piece
Step Pricing
Typical volume pricing approaches provide reduced pricing based on order quantity or annual quantity. Our step pricing model leverages your organization’s accumulated volume to help reduce your pricing as your deployment grows.
With Opal Kelly’s step pricing model, you are able to achieve lower pricing “steps” as your total volume increases. We keep track of your current step and apply this information to determine an adjusted price per unit.
Step pricing is a partnership. You provide forecast information about your requirements and, in turn, we use this forecast information to keep your supply chain running smoothly and deliver the same great product at a lower price. Step pricing is only available directly from Opal Kelly.
Contact Sales
Email sales@opalkelly.com for more information and to set up a step pricing agreement.
The XEM8370-KU11P is an FPGA development board based on the AMD Kintex UltraScale+ FPGA. In addition to support for the Opal Kelly FrontPanel SDK and SuperSpeed USB 3.0, the module includes high-efficiency power supplies for single-input power, 4 GiB DDR4, clock oscillators, and three mezzanine expansion connectors for access to fabric and transceiver I/O.
Designed for prototypes, proof-of-concept, and production, the XEM8370 is a great way to take advantage of the balance of price, performance, and power efficiency of the Kintex UltraScale+ architecture. Reduce time to market, focus on your team’s core competency, and simplify your supply chain. Higher volume production is supported by our Step Pricing program.
FrontPanel® SDK
Opal Kelly’s FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.
Prototyping and OEM Integration
Opal Kelly FPGA development boards are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there’s simply no faster, more reliable, production-ready way to jump start your FPGA design.
Block diagram
KINTEX US+ I/O
301 fabric I/O, 20 GTH transceiver lanes, and 8 GTY transceiver lanes
SINGLE INPUT POWER
Single-input (5 VDC to 18 VDC), high-efficiency switching power supplies provide stable, dependable power to the FPGA and peripherals
SUPERSPEED USB 3.0
Measured performance at over 350 MiB/s for real-world data transfers to/from the PC using Opal Kelly's FrontPanel SDK
4 GiB DDR4
Integrated 4-GiByte DDR4 provides loads of high-speed on-board memory for high-performance applications, including video capture and data acquisition
FrontPanel® SDK
Build high-performance software-connected FPGA applications for prototypes, proof-of-concept, and production.
A multi-platform, multi-language development kit designed to help you reach your project milestones faster. Production-ready with thousands of customer deployments.
Customer Deployments
Applications
Technical Specifications and Support
Features & Specifications
The XEM8370 features the AMD Kintex UltraScale+ (XCKU11P-1FFVA1156E) FPGA. It provides 653,100 system logic cells and 2,928 DSP slices, offering a high-performance path for prototyping and OEM deployment in demanding applications like JESD204B data converters.
The XEM8370 supports SuperSpeed USB 3.0 with measured real-world data transfer performance exceeding 350 MiB/s using the FrontPanel SDK. This high-bandwidth interface ensures efficient communication for demanding data-streaming applications.
The platform includes 4 GiByte DDR4 SDRAM with a 32-bit wide interface supporting a peak bandwidth of 76.8 Gb/s. Non-volatile memory includes 16 MiB SPI System Flash and 32 MiB QSPI FPGA Flash which supports gateware boot.
The XEM8370 is equipped with three high-density mezzanine connectors providing access to 301 FPGA fabric I/O. For serial connectivity, it features 20 GTH transceivers (up to 12.5 Gbps) and 8 GTY transceivers (up to 16.375 Gbps).
The board accepts a single DC input between 5 V and 18 V. It features an on-board cooling fan controller for an optional active heatsink (FANSINK-07), and integrated sensors monitor voltage, current, and temperature in real-time.
Engineers use the XEM8370 for automated high-end test equipment and protocol validation. Its 28 high-speed transceiver lanes allow for real-time signal analysis against standards like PCIe and MIPI.
In Aerospace and Defense, the XEM8370 is deployed for RADAR/LIDAR processing, satellite prototyping, and hardware-in-the-loop (HIL) simulation. The Kintex UltraScale+ FPGA provides the parallel processing power needed for Electronic Warfare (EW) systems.
Yes, its 2,928 DSP slices and 4 GiB DDR4 make it an ideal FPGA co-processor for edge machine learning, capable of deterministic AI inference for high-frame-rate machine vision.
The XEM8370 serves as a high-performance interface for 3D vision systems and IR imaging, processing multiple high-speed AV channels for automated visual inspection.
Institutions choose Opal Kelly for stable, off-the-shelf USB-to-FPGA connectivity, allowing focus on breakthroughs in SDR and measurement rather than custom interconnect design.
The FrontPanel SDK is a trio of firmware, software, and gateware providing a multi-platform API and lightweight HDL IP blocks to manage complex USB 3.0 communication automatically.
The SDK supports Windows, Linux, and macOS. Supported languages include C++, Python, Ruby, C#/.NET, Java, and DLL interfaces.
Developers use the FrontPanel Application to create virtual control panels with industry-standard XML descriptions. FrontPanel 6 also supports browser-based apps using JavaScript, HTML, and CSS.
JTAG access is provided via expansion connectors. This allows real-time debugging using AMD Vivado Hardware Manager and ILA with compatible breakout boards like the BRK8370.
Opal Kelly products are strictly lifecycle managed with Production, Limited Production, and End-of-Life status updates provided via opalkelly.com/products/lifecycle.
Released on May 9, 2022, the XEM8370 is currently in Production. Major Kintex UltraScale+ components have an estimated EOL reaching into 2045.
Additional Information:
Block Diagram Link
SlideDeck Link
FPGA
AMD Kintex UltraScale+
XEM8370-KU11P
FPGA Icon
Info FPGA List
AMD Kintex UltraScale+ XCKU11P-1FFVA1156E
Info Feature List
SUPERSPEED USB 3.0
SINGLE INPUT POWER
Interface
Interface Icon
Interface USB
Memory
4-GiB DDR4
16 MiB System Flash
32 MiB FPGA Flash
I/O
301 FPGA fabric I/O
20 GTH
8 GTY
Dimensions
120mm x 85mm
Addons
is End of Life?
is Limited Production?
show FrontPanel SDK?
show Step Pricing Info?
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