FAQ

The XEM7310MT features the AMD Artix-7 FPGA, available in two high-performance densities:

• XC7A75T (A75): Provides 75,520 system logic cells, 94,400 CLB flip-flops, and 180 DSP slices.
• XC7A200T (A200): Provides 215,360 system logic cells, 269,200 CLB flip-flops, and 740 DSP slices.

The XEM7310MT utilizes a SuperSpeed USB 3.0 Type-C interface with measured real-world data transfer performance exceeding 340 MiB/s using the FrontPanel SDK. This ensures rapid FPGA configuration and efficient streaming.

The module includes 1 GiByte DDR3 SDRAM with a 32-bit quad-wide interface, offering a peak memory bandwidth of 25.6 Gib/s. Non-volatile memory consists of two 16 MiB SPI Flash devices for system settings and design-specific storage.

The XEM7310MT features three high-density expansion connectors providing access to 136 user I/O pins. It provides access to a full Artix-7 GTP transceiver quad (4 TX/RX pairs) for high-speed serial protocols.

The board requires a single DC input between 4.5 V and 5.5 V (5.0 V nominal). High-efficiency switching regulators provide stable power, and a 200 MHz low-jitter oscillator provides the primary clock reference.

While both use Artix-7, the XEM7310MT (Multi-Transceiver) is optimized for high-speed serial tasks:

• Gigabit Transceivers: The MT model provides full GTP quad access; the standard model does not.
• USB Connector: The MT model uses USB Type-C.
• Physical Footprint: Slightly larger at 75mm x 60mm to accommodate transceiver routing.
• Connector Count: Uses three high-density connectors instead of two.

Engineers use it for ASIC simulation, CMOS image sensor testing, and radar field testing. The GTP transceivers allow for validation of protocols like PCIe or SATA in a compact form factor.

It is an ideal engine for high-speed video capture. The 1 GiB DDR3 buffer handles smooth frame processing, interfacing directly with camera sensors via transceivers.

Yes. By leveraging the 740 DSP slices (A200 model), developers implement deterministic AI inference for robotics and anomaly detection.

Researchers rely on stable "off-the-shelf" connectivity to focus on Software-Defined Radio (SDR) and photonics breakthroughs instead of custom hardware interconnects.

A trio of firmware, software, and HDL IP blocks that abstracts USB complexity. It enables developers to quickly establish a reliable data path using provided IP cores.

The SDK supports Windows, Linux, and macOS. APIs are available for C, C++, C#, Ruby, Python, and Java.

Developers use XML descriptions for virtual panels or FrontPanel 6's browser-based platform for JavaScript and HTML responsive interfaces.

1. HDL Design: Create logic in AMD Vivado with FrontPanel HDL IP blocks.
2. Software Integration: Use the SDK to define the data path to the host PC.
3. Deployment: Use FrontPanel Application for immediate control or a custom application.

The JTAG interface is accessible via expansion connectors or the BRK7310MT breakout board for real-time debugging (ILA) in Vivado.

Opal Kelly products are strictly lifecycle managed (Production, Limited Production, End-of-Life). Updates are available at opalkelly.com/products/lifecycle.

Released on July 16, 2019, the module is in Production. Estimated component EOL reaches into 2040.