The XEM7310 is a USB 3.0 FPGA development board based on the highly capable Xilinx Artix-7 FPGA. In addition to a high gate-count FPGA, the XEM7310 utilizes the high transfer rate of USB 3.0 enabling speedy FPGA configuration and data transfer. With integrated SDRAM, power supplies, and platform flash, the XEM7310 is the latest addition to Opal Kelly’s most popular form-factor.

Need access to the Artix-7 gigabit transceiver (GTP)? Consider the XEM7310MT!

Feature	XEM7310-A75	XEM7010-A50	XEM7310-A200	XEM7010-A200
Interface Measured Performance	USB 3.0 SuperSpeed 340+ MiB/s	USB 2.0 HighSpeed Up to 38 MB/s	USB 3.0 SuperSpeed 340+ MiB/s	USB 2.0 HighSpeed Up to 38 MB/s
FPGA Minimum Xilinx Tools Required	XC7A75T-1 Vivado WebPack	XC7A50T-1 Vivado WebPack	XC7A200T-1 Vivado WebPack
Slice Architecture	4 6-LUT, 8 DFF
Slices	11,800 (94,400 DFFs)	8,150 (65,200 DFFs)	33,650 (269,200 DFFs)
FPGA RAM	3,780 Kib BlockRAM 892 Kib Distributed	2,700 Kib BlockRAM 600 Kib Distributed	13,140 Kib BlockRAM 2,888 Kib Distributed
MULT / DSP	180	120	740
CMTs	6	5	10
On-Board DDR3 Banks, Width, Peak Bandwidth	1,024 MiB One, x32, 25.6 Gb/s	512 MiB One, x16, 12.8 Gb/s	1,024 MiB One, x32, 25.6 Gb/s	512 MiB One, x16, 12.8 Gb/s
System Flash FPGA Bootable?	128 Mib Yes	–	128 Mib Yes	–
FPGA Flash FPGA Bootable?	128 Mib No	32 Mib Yes	128 Mib No	32 Mib Yes

Xilinx Artix-7 (XC7A75T-1FGG or XC7A200T-1FBG)
2x 16-MiB serial flash (Numonyx N25Q128A)
1-GiByte DDR3 (Micron MT41K256M16TW or equivalent)
Small form-factor -- smaller than a credit card at 75mm x 50mm x 15.8mm (2.95" x 1.97" x 0.62")
SuperSpeed USB 3.0 interface (Cypress FX3) for configuration and data transfer
USB Type-C Connector
Measured performance over 340 MiB/s
Self-powered by external DC source
Low-jitter 200 MHz clock oscillator
Eight LEDs
Two 80-pin 0.8mm Samtec board-to-board connectors (BSE-040)
126 user I/O including 4 MRCC pairs, 4 SRCC pairs, and 1 XADC pair
Independent access to VCCO bank voltages
JTAG pins available on the expansion connectors
Full FrontPanel virtual control panel support
Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java

XEM7310 FAQ - Opal Kelly

FAQ

Q: What FPGA is used in the Opal Kelly XEM7310 integration module?

The XEM7310 features the AMD Artix-7 FPGA in two variants: the XC7A75T-1FGG484C (75,520 logic cells, 180 DSP slices) and the XC7A200T-1FBG484C (215,360 logic cells, 740 DSP slices).

Q: What is the maximum data transfer rate of the XEM7310?

Utilizing a SuperSpeed USB 3.0 interface (Cypress FX3), the XEM7310 delivers measured real-world data transfer performance exceeding 340 MiB/s using the FrontPanel SDK.

Q: How much memory is available on the XEM7310?

The module includes 1 GiByte DDR3 SDRAM with a 32-bit quad-wide interface (25.6 Gib/s peak bandwidth) and two separate 16 MiB SPI Flash devices.

Q: What expansion ports are available on the XEM7310?

It is equipped with two high-density, 80-pin expansion connectors (Samtec BSE-040) providing access to 126 user I/O pins, including MRCC, SRCC, and XADC pairs.

Q: What are the power supply requirements for the XEM7310?

The board requires a clean DC input between 4.5 V and 5.5 V. High-efficiency on-board switching regulators provide necessary power for the FPGA and peripherals.

Q: What are the main differences between the XEM7310 and the XEM7310MT?

The XEM7310MT provides access to a full Artix-7 GTP transceiver quad (4 TX/RX pairs) and uses a USB Type-C connector, while the standard XEM7310 is slightly smaller and offers 126 user I/O without transceivers.

Q: How is the XEM7310 utilized in Industrial and Machine Vision?

Engineers use it for visual inspection, 3D depth sensing, and real-time image processing, often integrating it into smart cameras and visionary robotics.

Q: What role does the XEM7310 play in Test & Measurement?

It serves as a data acquisition engine for automated device and radar field testing, allowing for high-speed data buffering and real-time signal analysis.

Q: Can the XEM7310 be used for Edge AI and Machine Learning?

Yes, by leveraging up to 740 parallel DSP slices (A200 model), developers can implement deterministic AI inference for robotics and anomaly detection.

Q: Why do Academic and Research institutions choose Opal Kelly modules?

Researchers rely on stable, off-the-shelf USB-to-FPGA connectivity to focus on breakthroughs in scientific instrumentation without custom hardware overhead.

XEM7310 Technical Specifications

What FPGA is used in the Opal Kelly XEM7310 integration module?

The XEM7310 is available in two high-performance variants featuring the AMD Artix-7 FPGA:

XC7A75T (A75): Features 75,520 system logic cells, 94,400 CLB flip-flops, 180 DSP slices, and 3,780 Kib of Block RAM.
XC7A200T (A200): Features 215,360 system logic cells, 269,200 CLB flip-flops, 740 DSP slices, and 13,140 Kib of Block RAM.

What is the maximum data transfer rate of the XEM7310?

Utilizing a SuperSpeed USB 3.0 interface (Cypress FX3), the XEM7310 delivers measured real-world data transfer performance exceeding 340 MiB/s using the FrontPanel SDK. This ensures fast downloads and efficient communication for data-intensive applications.

How much memory is available on the XEM7310?

The module includes 1 GiByte DDR3 SDRAM with a full 32-bit quad-wide interface to the FPGA. This provides a peak bandwidth of 25.6 Gib/s at a 400 MHz clock rate. Non-volatile storage includes two separate 16 MiB SPI Flash devices.

What expansion ports are available on the XEM7310?

The XEM7310 is equipped with two high-density, 80-pin expansion connectors (Samtec BSE-040) providing access to 126 user I/O pins. These include 4 MRCC pairs, 4 SRCC pairs, and 1 XADC pair for flexible system integration.

What are the power supply requirements for the XEM7310?

The board requires a single filtered DC input between 4.5 V and 5.5 V. High-efficiency on-board switching regulators provide power for the FPGA and peripherals.

Comparison: XEM7310 vs. XEM7310MT

What are the main differences between the XEM7310 and the XEM7310MT?

High-Speed Transceivers: The XEM7310MT provides access to Artix-7 GTP transceivers (one full quad), which are not available on standard XEM7310 connectors.
Footprint: The XEM7310MT is slightly larger (75mm x 60mm) compared to the standard XEM7310 (75mm x 50mm).
I/O Count: The standard XEM7310 offers 126 user I/O, while the MT model provides 136 user I/O plus the transceiver quad.

Industry Use Cases & Applications

How is the XEM7310 utilized in Industrial and Machine Vision?

Engineers use the XEM7310 for visual inspection, 3D sensing, and image processing. Its USB 3.0 interface allows integration into smart cameras and vision-guided robotics.

What role does the XEM7310 play in Test & Measurement?

It serves as a data acquisition engine for automated device and radar field testing. It enables real-time signal analysis without the complexity of custom FPGA infrastructure.

Can the XEM7310 be used for Edge AI and Machine Learning?

Yes. By leveraging the parallel DSP slices (up to 740), developers can implement deterministic AI inference for robotic control and anomaly detection.

Why do Academic and Research institutions choose Opal Kelly modules?

Researchers choose the XEM7310 for its stable USB-to-FPGA connectivity, allowing labs to focus on core breakthroughs in fields like bioinformatics.

FrontPanel® SDK Capabilities

What is the FrontPanel SDK and how does it benefit FPGA developers?

The FrontPanel SDK is a powerful trio of firmware, software, and gateware that abstracts the complexity of USB communication. It allows developers to quickly establish a reliable data path using provided IP cores.

Which programming languages and operating systems are supported?

The SDK supports Windows, Linux, and macOS. Supported languages include C, C++, C#, Ruby, Python, and Java.

Product Lifecycle & Management

How does Opal Kelly manage the lifecycle of its products?

Opal Kelly products are strictly lifecycle managed with updates (Production, Limited Production, End-of-Life) available at opalkelly.com/products/lifecycle.

What is the history and status of the XEM7310?

Released on January 24, 2017, the module is in Production. It has an estimated component end-of-life out to 2040.