XEM6310 Integration Evaluation Acceleration

XEM6310
XEM6310-LX45
XC6SLX45-2C, 128-MiB
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XEM6310-LX150
XC6SLX150-2C, 128-MiB
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BRK6110
Breakout Board
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EVB1005
5 Mp CMOS image sensor board
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EVB100X-DEV
Developer's Release for EVB100X
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The XEM6310 is a USB 3.0 integration module based on the remarkably-capable Xilinx Spartan-6 FPGA. In addition to a high gate-count FPGA, the XEM6310 utilizes the high transfer rate of USB 3.0 for configuration downloads, enabling speedy FPGA configuration and data transfer. With integrated SDRAM, power supplies, and platform flash, the XEM6310 is a worthy addition to Opal Kelly’s most popular form-factor.

Feature Image FrontPanel SDK

Opal Kelly's FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.

Feature Image Prototyping and OEM Integration

Opal Kelly FPGA integration modules are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there's simply no faster, more reliable, production-ready way to jump start your FPGA design.

Block Diagram

xem6310
ddr-memory
128 MiB DDR2

Integrated 128-MiByte DDR2 provides plenty of on-board memory for high-performance applications, including image capture and data acquisition.

power-supply
HIGH-EFFICIENCY POWER SUPPLIES

High-efficiency switching power supplies provide stable, dependable power to the FPGA. In most applications, there is enough extra juice to also supply your board.

usb
SUPERSPEED USB 3.0

Measured performance at over 340 MiB/s for real-world data transfers to/from the PC.

flash
BOOTABLE SERIAL FLASH (2x 16 MiB)

The XEM6310 integrates 16 MiB of on-board serial Flash for standalone FPGA booting and miscellaneous nonvolatile memory and a separate 16 MiB serial Flash for exclusive FPGA use.

Customer Deployments

  • CMOS image sensor test equipment
  • Radar system - test interface, system integration, field testing
  • Evaluation platform for semiconductors
  • Bioinformatics co-processors
  • Camera interface for IR and LIDAR 3D cameras
  • Equipment for analyzing satellite imagery
  • Design of equipment for mineral exploration
  • University research
  • University classroom design projects

Applications

  • Image or video capture / processing
  • Data acquisition
  • ASIC / hardware-based simulation and verification
  • Bioinformatics (DNA search and pattern matching)
  • Digital communications
  • High-speed USB / FPGA co-processor
  • Evaluation platform for your product
  • Custom test equipment
  • Cryptography
  • Data Security

Product Comparison

Feature XEM6310-LX45 XEM6010-LX45 XEM6310-LX150 XEM6010-LX150
Interface
Measured Performance
USB 3.0 SuperSpeed
340+ MiB/s
USB 2.0 HighSpeed
Up to 38 MB/s
USB 3.0 SuperSpeed
340+ MiB/s
USB 2.0 HighSpeed
Up to 38 MB/s
FPGA
Minimum Xilinx Tools Required
XC6SLX45-2
ISE WebPack
XC6SLX150-2
ISE Logic Edition
Slice Architecture 4 6-LUT, 8 DFF
Slices 6,822 (54,576 DFFs) 23,038 (184,304 DFFs)
FPGA RAM 2,088 Kib BlockRAM
401 Kib Distributed
4,824 Kib BlockRAM
1,355 Kib Distributed
MULT / DSP1 58 180
MCB2
PLLs ✓ (4 CMT) ✓ (6 CMT)
On-Board DDR2
Banks, Width, Peak Bandwidth
128 MiB
One, x16, 10 Gb/s
System Flash
FPGA Bootable?
128 Mib
Yes
- 128 Mib
Yes
-
FPGA Flash
FPGA Bootable?
128 Mib
No
32 Mib
Yes
128 Mib
No
32 Mib
Yes
  • 1 Spartan-6 DSP blocks include MULT and integrated 48-bit accumulator.
  • 2 Spartan-6 MCBs (memory controller blocks) reduce the fabric resources consumed for memory support.

Technical Specifications and Support

Features & Specifications

  • Xilinx Spartan-6 (XC6SLX45-2FGG or XC6SLX150-2FGG)
  • 2x 16-MiB serial flash (Numonyx N25Q128A)
  • 128-MiByte DDR2 (Micron MT47H64M16HR)
  • Small form-factor -- smaller than a credit card at 75mm x 50mm x 15.9mm (2.95" x 1.97" x 0.63")
  • High-speed USB 3.0 interface (Cypress FX3) for configuration and data transfer
  • Measured performance over 340 MiB/s
  • Self-powered by external DC source
  • Low-jitter 100 MHz clock oscillator
  • Eight LEDs
  • Two 80-pin 0.8mm Samtec board-to-board connectors (BSE-040)
  • Over 110 user I/O and 4 GCLK pins on expansion connectors
  • Independent access to VCCO bank voltages
  • JTAG pins available on the expansion connectors
  • Full FrontPanel virtual control panel support
  • Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java