XEM3010 Integration Evaluation

XEM3010
XEM3010-1500P
XC3S1500-4, 32-MB SDRAM, Platform Flash
1-9 pcs
10-99 pcs
100+ pcs
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XEM3010-1500PI
Industrial temp version
1 pc
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XEM3010-1000
XC3S1000-4, 32-MB SDRAM
1 pc
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The XEM3010 is an integration module based on a 1,500,000-gateXilinx Spartan-3 FPGA (XEM3010-1500P) or 1,000,000-gate(XEM3010-1000). In addition to a high gate-count FPGA, the XEM3010 utilizes the high transfer rate of USB 2.0 for configuration downloads, enabling speedy FPGA configuration and data transfer. With integrated SDRAM, power supplies, and platform flash, the XEM3010 is the most popular Spartan-3 module.

FrontPanel™ SDK

Opal Kelly’s FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.

FlashPrototyping and OEM Integration

Opal Kelly FPGA integration modules are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there’s simply no faster, more reliable, production-ready way to jump start your FPGA design.


Block diagram

Features

XILINX PLATFORM FLASH

If you need standalone operation, Xilinx Platform Flash can configure the FPGA on startup and still allow you to communicate over USB.

32 MiB SDRAM

Integrated 32-MByte SDRAM provides plenty of on-board memory for high-performance applications, including image capture and data acquisition.

MULTI-OUTPUT PLL

The on-board PLL provides flexible clocking to the FPGA and expansion connectors.

SWITCHING POWER SUPPLIES

High-efficiency switching power supplies provide stable, dependable power to the FPGA. In most applications, there is enough extra juice to also supply your board.

Customer Deployments

  • Medical device for physical therapy feedback
  • CMOS image sensor test equipment
  • Radar system - test interface, system integration, field testing
  • Microprocessor power module testing
  • Ion beam equipment for inspection/modification of semiconductors
  • Semiconductor development and testing
  • Camera interface for IR and LIDAR 3D cameras
  • Equipment for analyzing satellite imagery
  • Prototyping of image processing algorithms and display timing controllers for smart phones
  • Design of equipment for mineral exploration

Applications

  • Image or video capture / processing
  • Data acquisition
  • Digital communications
  • High-speed USB / FPGA co-processor
  • High-speed USB / FPGA co-processor
  • Custom test equipment

Technical Specifications and Support

Features & Specifications

  • Xilinx Spartan-3 (XC3S1000-4FG320 or XC3S1500-4FG320)
  • Optional Xilinx Platform Flash PROM for configuration storage and standalone operation
  • 32-MByte SDRAM (Micron MT48LC16M16)
  • Small form-factor -- smaller than a credit card at 75mm x 50mm x 15.9mm (2.95" x 1.97" x 0.63")
  • High-speed USB 2.0 interface (Cypress FX2LP - CY68013A) for downloading and control
  • Self-powered by external DC source
  • Multi-PLL, multi-output clock generator (Cypress CY22393)
  • Eight LEDs and two pushbuttons
  • Two 80-pin 0.8mm Samtec board-to-board connectors (BSE-040)
  • Over 110 user I/O and 4 GCLK pins on expansion connectors
  • Independent access to VCCO bank voltages
  • Optional resistors for digitally-controlled impedance (DCI)
  • JTAG pins available on a 2mm header as well as the expansion connectors
  • Full FrontPanel virtual control panel support
  • Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java