XEM7350
FPGA Development Board with AMD-Xilinx Kintex 7

Product Release
2014-05-27

Lifecycle Status
Limited Production:
XEM7350-K70T

Production:
All others

Minimum Order Quantity
XEM7350-K70T:
1 pcs while inventory lasts
Then 50 pcs

All others:
1 pcs

Variant Pricing
This product is available in variant configurations that may have minimum order quantities, additional fees, or extended lead times when not in stock. Contact sales@opalkelly.com for more information.


1 PC

  • PSS050-25
    5V Power Supply for use with the BRKD-ACV
  • FANSINK-08
    Fan heatsink for the XEM7350

The XEM7350 is a USB 3.0 FPGA development board based on the Xilinx Kintex-7 FPGA. In addition to a high gate-count FPGA, the XEM7350 utilizes the high transfer rate of USB 3.0 for configuration downloads, enabling speedy FPGA configuration and data transfer. With integrated SDRAM, power supplies, platform flash, high-speed transceivers, FMC-HPC connector, and voltage/current/temperature monitoring, the XEM7350 is ideal for high-performance I/O integration.

Front panel

FrontPanel® SDK

Opal Kelly’s FrontPanel SDK is an easy-to-use, robust API for communication, configuration, and interfacing to your PC, Mac or Linux hardware. FrontPanel handles all the interaction between your software and the FPGA internals, dramatically reducing the time and effort required to interface to a design.

Flash

Prototyping and OEM Integration

Opal Kelly FPGA integration modules are designed to be the ideal turnkey solution for prototypes and OEM product integration. With the complete FrontPanel SDK, there’s simply no faster, more reliable, production-ready way to jump start your FPGA design.

Block diagram

Block Diagram
 ARTIX US+ I/O

GIGABIT SERIAL TRANSCEIVERS (x8)

Eight high-speed gigabit transceivers are available with standard support for PCI Express, DisplayPort, HD-SDI, XAUI, Aurora, SATA, and others operating up to 6.6 Gb/s (12.5 Gb/s optional).

 SINGLE INPUT POWER

SUPERSPEED USB 3.0

Measured performance at over 340 MiB/s for real-world data transfers to/from the PC.

SUPERSPEED USB 3.0

512 MiB DDR3

Integrated 512-MiByte DDR3 provides plenty of on-board memory for high-performance applications, including image capture and data acquisition.

2 GiB DDR4

DEVICE SENSORS

Integrated device sensors provide real-time measurement of temperature as well as voltage and current of the on-board high-efficiency switching power supplies. Measurements are available via the API.

Customer Deployments

  • Bioinformatics co-processors
  • Radar system - test interface, system integration, field testing
  • Camera interface for IR and LIDAR 3D cameras
  • Equipment for analyzing satellite imagery
  • University research
  • Design of equipment for mineral exploration

Applications

  • Image or video capture / processing
  • Data acquisition (including JESD204B)
  • ASIC / hardware-based simulation and verification
  • High-Speed (Gigabit) Serial Interfaces
  • Digital communications
  • High-speed USB / FPGA co-processor
  • Evaluation platform for your product
  • Custom test equipment
  • Cryptography
  • Data Security

Product Comparison

Feature XEM7350-K70T XEM7350-K160T XEM7350-K410T
FPGA XC7K70T-1FBG676C XC7K160T-1FFG676C XC7K410T-1FFG676C
CLB • Slices 10,250 25,350 63,550
CLB • Distributed RAM 838 Kib 2,188 Kib 5,663 Kib
Block RAM 4,860 Kib 11,700 Kib 28,620 Kib
DSP Slices 240 600 1,540
CMTs 6 8 10
FPGA I/O 76 I/O8 Gigabit Transceivers 169 I/O8 Gigabit Transceivers

Technical Specifications and Support

Features & Specifications

  • Xilinx Kintex-7 XC7K70T-1FBG676C (option: XC7K160T-1FFG676C, XC7K410T-1FFG676C)
  • 2x 16-MiB serial flash (Numonyx N25Q128A)
  • 512-MiB DDR3 (Micron MT41K256M16HA)
  • Small form-factor -- 80mm x 70mm x 15.1mm (3.15" x 2.76" x 0.60")
  • SuperSpeed USB 3.0 interface (Cypress FX3) for configuration and data transfer
  • Measured performance over 340 MiB/s
  • Self-powered by external DC source
  • Low-jitter 200 MHz clock oscillator
  • Low-jitter 100 MHz clock oscillator (Gigabit Transceiver Reference)
  • Four LEDs
  • One FMC-HPC board-to-board connector
  • 76 user I/O including GCLK pins on FMC expansion (-70T)
  • 169 user I/O including GCLK pins on FMC expansion (-160T and -410T)
  • 8 Gigabit Transceivers and 3 reference clock pairs
  • Independent access to VCCO bank voltages
  • On-board device sensors for real-time voltage, current, and temperature monitoring
  • JTAG pins available on the expansion connectors
  • Full FrontPanel virtual control panel support
  • Complete Application Programmer's Interface (API) in C, C++, C#, Ruby, Python, and Java

Additional Information:

Block Diagram Link

/assets/blockdiagrams/XEM7350-BlockDiagram.png

SlideDeck Link

FPGA

AMD Kintex-7
XC7K70T
XC7K160T
XC7K410T (optional)

FPGA Icon

/assets/fpgaarchitecture/logo-K7-38x56.png

Info FPGA List

Info Feature List

Interface

Interface Icon

/assets/hostinterface/icon-connection-fp.png

Interface USB

/assets/hostinterface/usb30.png

Memory

512-MiB DDR3
128-Mib Serial (boot)
128-Mib Serial (FPGA)

I/O

76+ (-70T)
169+ (-160T/-410T)
8 GBT Transceivers

Dimensions

80mm x 70mm

Addons

is End of Life?

is Limited Production?

show FrontPanel SDK?

show Step Pricing Info?

Yes

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